Skip to main content
SpringerLink
Log in

A Comparison Between Cold-Welded and Diffusion-Bonded Al/Cu Bimetallic Rods Produced by ECAE Process

  • Published:
Journal of Materials Engineering and Performance Aims and scope Submit manuscript

Abstract

In this research, the application of equal channel angular extrusion process to produce both the cold-welded and diffusion-bonded Al/Cu bimetallic rods is assessed. The joints shear strength for both of the methods are measured and compared. The microstructure examinations were also carried out using scanning electron microscope equipped with EDX system and x-ray diffraction analysis. The results exhibit that the strength of the bond in cold-welded specimens is dependent on the amount of stretch and pressure at the materials interface. But in the diffusion-bonded specimens, it is depended on the struggle between the oxidation rate of the mating surfaces accompanied by inter-metallic compounds formation and the aluminum and copper atoms ability to diffuse in the joint interface.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14

Similar content being viewed by others

References

  1. H. Papkala and A. Pietras, Pressure Welding of Aluminium to Copper, Weld. Int., 2006, 20(3), p 173–182

    Article  Google Scholar 

  2. P. Liu, Q. Shi, W. Wang, X. Wang, and Z. Zhang, Microstructure and XRD Analysis of FSW Joints for Copper T2/Aluminium 5A06 Dissimilar Materials, Mater. Lett., 2008, 62(25), p 4106–4108

    Article  CAS  Google Scholar 

  3. Y. Guo, G. Qiao, W. Jian, and X. Zhi, Microstructure and Tensile Behavior of Cu-Al Multi-layered Composites Prepared by Plasma Activated Sintering, Mater. Sci. Eng. A, 2010, 527(20), p 5234–5240

    Article  Google Scholar 

  4. A. Abdollah-Zadeh, T. Saeid, and B. Sazgari, Microstructural and Mechanical Properties of Friction Stir Welded Aluminum/Copper Lap Joints, J. Alloys Compd., 2008, 460(1–2), p 535–538

    Article  CAS  Google Scholar 

  5. M. Eizadjou, A. Kazemi Talachi, H. Danesh Manesh, H. Shakur Shahabi, and K. Janghorban, Investigation of Structure and Mechanical Properties of Multi-layered Al/Cu Composite Produced by Accumulative Roll Bonding (ARB) Process, Compos. Sci. Technol., 2008, 68(9), p 2003–2009

    Article  CAS  Google Scholar 

  6. S. Madhusudan, M.M.M. Sarcar, and N.R.M.R. Bhargava, Fabrication and Characterization of Aluminium-Copper Composites, J. Alloys Compd., 2009, 471(1–2), p 116–118

    Article  CAS  Google Scholar 

  7. W.E. Verkamp, Copper-to-Aluminum Transitions in High DC Bus Systems, IEEE Trans. Ind. Appl., 1997, 33(4), p 1027–1034

    Article  Google Scholar 

  8. M. Braunovic, and N. Aleksandrov, Effect of Electrical Current in Bimetallic Aluminum-Copper Joint, IEEE Trans. Paper No. CHMT- 93-10, 1993, p 261–268

  9. T.-G. Zhou, Z.Y. Jiang, J.L. Wen, and A.K. Tieu, A Method to Produce Aluminum Alloy Tube Busbars by Continuous Casting-Expansion Extrusion, J. Mater. Process. Technol., 2006, 177(1–3), p 163–166

    Article  CAS  Google Scholar 

  10. A. Khosravifard and R. Ebrahimi, Investigation of Parameters Affecting Interface Strength in Al/Cu Clad Bimetal Rod Extrusion Process, Mater. Des., 2010, 31(1), p 493–499

    Article  CAS  Google Scholar 

  11. T.T. Sasaki, R.A. Morris, G.B. Thompson, Y. Syarif, and D. Fox, Formation of Ultra-Fine Copper Grains in Copper-Clad Aluminum Wire, Scripta Mater., 2010, 63(5), p 488–491

    Article  CAS  Google Scholar 

  12. Z.-C. Lin and T.-G. Huang, Hot Rolling of an Aluminum-Copper Sandwich Flat Strip with the Three-Dimensional Finite Element Method, J. Mater. Process. Technol., 2000, 99(1–3), p 154–168

    Article  Google Scholar 

  13. W. Lehnert and N.D. Cuong, Experimental and Mathematical Simulation of Microstructural Evolution During Hot Rolling of Al and Cu Material, J. Mater. Process. Technol., 1996, 60(1–4), p 567–574

    Article  Google Scholar 

  14. A.G. Mamalis, N.M. Vaxevanidis, A. Szalay, and J. Prohaszka, Fabrication of Aluminium/Copper Bimetallics by Explosive Cladding and Rolling, J. Mater. Process. Technol., 1994, 44(1–2), p 99–117

    Article  Google Scholar 

  15. H. Dyja, S. Mróz, and A. Milenin, Theoretical and Experimental Analysis of the Rolling Process of Bimetallic Rods Cu-Steel and Cu-Al, J. Mater. Process. Technol., 2004, 153–154, p 100–107

    Article  Google Scholar 

  16. M. Abbasi, A. Karimi Taheri, and M.T. Salehi, Growth Rate of Intermetallic Compounds in Al/Cu Bimetal Produced by Cold Roll Welding Process, J. Alloys Compd., 2001, 319(1–2), p 233–241

    Article  CAS  Google Scholar 

  17. L.Y. Sheng, F. Yang, T.F. Xi, C. Lai, and H.Q. Ye, Influence of Heat Treatment on Interface of Cu/Al Bimetal Composite Fabricated by Cold Rolling, Composites Part B, 2011, 42(6), p 1468–1473

    Article  Google Scholar 

  18. H.J. Park, K.H. Na, N.S. Cho, Y.S. Lee, and S.W. Kim, A Study of the Hydrostatic Extrusion of Copper-Clad Aluminium Tube, J. Mater. Process. Technol., 1997, 67(1–3), p 24–28

    Article  Google Scholar 

  19. A.R. Eivani and A. Karimi Taheri, A New Method for Producing Bimetallic Rods, Mater. Lett., 2007, 61(19–20), p 4110–4113

    Article  CAS  Google Scholar 

  20. A. Sivaraman and U. Chakkingal, Flow Properties of Commercial Purity Aluminum Processed by Equal Channel Angular Pressing, Mater. Sci. Eng. A, 2008, 487(1–2), p 264–270

    Google Scholar 

  21. A. Gholinia, P.B. Prangnell, and M.V. Markushev, The Effect of Strain Path on the Development of Deformation Structures in Severely Deformed Aluminium Alloys Processed by ECAE, Acta Mater., 2000, 48(5), p 1115–1130

    Article  CAS  Google Scholar 

  22. D.J. Alexander, New Methods for Severe Plastic Deformation Processing, J. Mater. Eng. Perform., 2007, 16(3), p 360–374

    Article  CAS  Google Scholar 

  23. H.G. Salem and J.S. Lyons, Effect of Equal Channel Angular Extrusion on the Microstructure and Superplasticity of an Al-Li Alloy, J. Mater. Eng. Perform., 2002, 11(4), p 384–391

    Article  CAS  Google Scholar 

  24. L.D. Hefti, Advances in Fabricating Superplastically Formed and Diffusion Bonded Components for Aerospace Structures, J. Mater. Eng. Perform., 2004, 13(6), p 678–682

    Article  CAS  Google Scholar 

  25. W.H. Huang, C.Y. Yu, P.W. Kao, and C.P. Chang, The Effect of Strain Path and Temperature on the Microstructure Developed in Copper Processed by ECAE, Mater. Sci. Eng. A, 2004, 366(2), p 221–228

    Article  Google Scholar 

  26. S. Qu, X.H. An, H.J. Yang, C.X. Huang, G. Yang, Q.S. Zang, Z.G. Wang, S.D. Wu, and Z.F. Zhang, Microstructural Evolution and Mechanical Properties of Cu-Al Alloys Subjected to Equal Channel Angular Pressing, Acta Mater., 2009, 57(5), p 1586–1601

    Article  CAS  Google Scholar 

  27. V.M. Segal, Materials Processing by Simple Shear, Mater. Sci. Eng. A, 1995, 197(2), p 157–164

    Article  Google Scholar 

  28. R.Z. Valiev and T.G. Langdon, Principles of Equal-Channel Angular Pressing as a Processing Tool for Grain Refinement, Prog. Mater. Sci., 2006, 51(7), p 881–981

    Article  CAS  Google Scholar 

  29. K. Narooei and A. Karimi Taheri, A New Model for Prediction the Strain Field and Extrusion Pressure in ECAE Process of Circular Cross Section, Appl. Math. Model., 2010, 34(7), p 1901–1917

    Article  Google Scholar 

  30. A.R. Eivani, S. Ahmadi, E. Emadoddin, S. Valipour, and A. Karimi Taheri, The Effect of Deformations Passes on the Extrusion Pressure in Axi-symmetric Equal Channel Angular Extrusion, Comput. Mater. Sci., 2009, 44(4), p 1116–1125

    Article  CAS  Google Scholar 

  31. Y.C. Yuan, A.B. Ma, J.H. Jiang, and D.H. Yang, Finite Element Analysis of the Deformation Distribution During Multi-Pass Rotary-Die ECAP, J. Mater. Eng. Perform., 2011, 20(8), p 1378–1384

    Article  CAS  Google Scholar 

  32. A.R. Eivani and A. Karimi Taheri, The Effect of Dead Metal Zone Formation on Strain and Extrusion Force During Equal Channel Angular Extrusion, Comput. Mater. Sci., 2008, 42(1), p 14–20

    Article  CAS  Google Scholar 

  33. A.R. Eivani and A. Karimi Taheri, A New Method for Estimating Strain in Equal Channel Angular Extrusion, J. Mater. Process. Technol., 2007, 183(1), p 148–153

    Article  CAS  Google Scholar 

  34. C. Xu, T.G. Langdon, Z. Horita, and M. Furukawa, Using Equal-Channel Angular Pressing for the Production of Superplastic Aluminum and Magnesium Alloys, J. Mater. Eng. Perform., 2004, 13(6), p 683–690

    Article  CAS  Google Scholar 

  35. P. Eslami and A. Karimi Taheri, An Investigation on Diffusion Bonding of Aluminum to Copper Using Equal Channel Angular Extrusion Process, Mater. Lett., 2011, 65(12), p 1862–1864

    Article  CAS  Google Scholar 

  36. M. Zebardast and A. Karimi Taheri, The Cold Welding of Copper to Aluminum Using Equal Channel Angular Extrusion (ECAE) Process, J. Mater. Process. Technol., 2011, 211(6), p 1034–1043

    Article  CAS  Google Scholar 

  37. W. Zhang and N. Bay, A Numerical Model for Cold Welding of Metals, CIRP Ann. Manuf. Technol., 1996, 45(1), p 215–220

    Article  Google Scholar 

  38. M. Acarer, Electrical, Corrosion, and Mechanical Properties of Aluminum-Copper Joints Produced by Explosive Welding, J. Mater. Eng. Perform., 2012, 21(11), p 2375–2379

    Google Scholar 

  39. P.K. Wright, D.A. Snow, and C.K. Tay, Interfacial Conditions and Bond Strength in Cold Pressure Welding by Rolling, Met. Technol., 1978, 5(1), p 24–31

    Google Scholar 

  40. N. Bay, Cold Welding: Part I, Characteristic, Bonding Mechanisms, Bond Strength, Met. Constr., 1986, 18(6), p 369–372

    CAS  Google Scholar 

  41. T. Tabata, S. Masaki, and K. Azekura, Bond Criterion in Cold Pressure Welding of Aluminum, Mater. Sci. Technol., 1989, 5(4), p 377–381

    Article  CAS  Google Scholar 

  42. G. Mahendran, S. Babu, and V. Balasubramanian, Analyzing the Effect of Diffusion Bonding Process Parameters on Bond Characteristics of Mg-Al Dissimilar Joints, J. Mater. Eng. Perform., 2010, 19(5), p 657–665

    Article  CAS  Google Scholar 

  43. L.D. Hefti, Innovations in the Superplastic Forming and Diffusion Bonded Process, J. Mater. Eng. Perform., 2008, 17(2), p 178–182

    Article  CAS  Google Scholar 

  44. Y. Xiang, S. Wu, and D. Chen, Fracture Toughness of Superplastic Formed/Diffusion Bonded Interfaces, J. Mater. Eng. Perform., 2001, 10(6), p 679–684

    Article  CAS  Google Scholar 

  45. T.I. Khan and O. Ohashi, Effect of Argon Ion Bombardment on the Solid-State Diffusion Bonding of Copper, Scripta Mater., 1998, 38(10), p 1525–1532

    Article  CAS  Google Scholar 

  46. X.G. Qiao, M.J. Starink, and N. Gao, Hardness Inhomogeneity and Local Strengthening Mechanisms of an Al1050 Aluminium Alloy After One Pass of Equal Channel Angular Pressing, Mater. Sci. Eng. A, 2009, 513–514, p 52–58

    Google Scholar 

  47. C.G. Kang, Y.J. Jung, and H.C. Kwon, Finite Element Simulation of Die Design for Hot Extrusion Process of Al/Cu Clad Composite and Its Experimental Investigation, J. Mater. Process. Technol., 2002, 124(1–2), p 49–56

    Article  CAS  Google Scholar 

  48. L.R. Vaidyanath, M.G. Nicholas, and D.R. Milner, Pressure Welding by Rolling, Weld. J., 1959, 6, p 13–28

    Google Scholar 

  49. W.-B. Lee, K.-S. Bang, and S.-B. Jung, Effects of Intermetallic Compound on the Electrical and Mechanical Properties of Friction Welded Cu/Al Bimetallic Joints During Annealing, J. Alloys Compd., 2005, 390(1–2), p 212–219

    Article  CAS  Google Scholar 

  50. P. He and D. Liu, Mechanism of Forming Interfacial Intermetallic Compounds at Interface for Solid State Diffusion Bonding of Dissimilar Materials, Mater. Sci. Eng. A, 2006, 437(2), p 430–435

    Article  Google Scholar 

  51. J.O. Koizumi, M. Araki, and I. Hitachi, Investigation of the Reliability of Copper Ball Bonds to Aluminum Electrodes, IEEE Trans. Compon. Hybrids Manuf. Technol., 1987, 10(4), p 550–555

    Article  Google Scholar 

  52. H.J. Kim, J.Y. Lee, K.W. Paik, K.W. Koh, J.H. Won, S.H. Choi, J. Lee, J.T. Moon, and Y.J. Park, Effects of Cu/Al Intermetallic Compound (IMC) on Copper Wire and Aluminum Pad Bondability, IEEE Trans. Compon. Packag. Technol., 2003, 26(2), p 367–374

    Article  CAS  Google Scholar 

Download references

Acknowledgments

The authors would like to thank the Iran National Science Foundation (INSF) and the Research Board of Sharif University of Technology for the financial support and the provision of the research facilities used in this work.

Author information

Authors and Affiliations

  1. Department of Materials Science and Engineering, Sharif University of Technology, Azadi Ave., P.O. Box 11365-9466, Tehran, Iran

    P. Eslami, A. Karimi Taheri & M. Zebardast

Authors
  1. P. Eslami
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. A. Karimi Taheri
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. M. Zebardast
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to A. Karimi Taheri.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Eslami, P., Karimi Taheri, A. & Zebardast, M. A Comparison Between Cold-Welded and Diffusion-Bonded Al/Cu Bimetallic Rods Produced by ECAE Process. J. of Materi Eng and Perform 22, 3014–3023 (2013). https://doi.org/10.1007/s11665-013-0591-2

Download citation

  • Received:

  • Revised:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11665-013-0591-2

Keywords

Search

Navigation